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Lim Wee Teck, Secretary

[email protected]

Lim Wee Teck, Secretary

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Past Events by EPS Malaysia

ALL EVENTS ORGANIZED BY EPS MALAYSIA

The following activities have been tentatively planned for the year 2015, 2016, 2017, 2018 and 2019. These activities have been carefully considered and the speakers/invited guests are well selected to bring the utmost benefit and knowledge advancement to IEEE-EPS Malaysian Chapter members.

EPS Events in 2021

ML/AI for Advanced Semiconductor Packaging & Electronics Manufacturing

Date: 2nd December 2021 (Thursday)

Venue: CISCO WebEx

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Advanced Packaging for Autonomous Driving

Date: 27 July 2021 (Tuesday)

Venue: CISCO WebEx

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Sintered Silver As Die Attach Materials

Date: 6 July 2021 (Tuesday)

Venue: CISCO WebEx

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Optical Profiler Characterization of Electronic Devices & Packaging Using White Light Interferometry

Date: 2 June 2021 (Wednesday)

Venue: CISCO WebEx

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Octagonal Relationship of Engineering Materials for Advanced Packaging

Date: 13 April 2021 (Tuesday)

Venue: CISCO WebEx

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EPS Events in 2020

The Evolution Of Lead-Free Solder

Date: December 16 2020

Venue: CISCO WebEx

Webinar on-demand
Note: Login your EPS account to view
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Direction and Opportunities in Heterogeneous Integration using Advanced Packaging

Date: October 16 2020

Venue: CISCO Webex

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What’s Driving Automotive Electronics Assembly and Packaging

Date: October 14 2020

Venue: CISCO Webex

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EPS Events in 2019

IEEE EPS Malaysia: 2019 Semiconductor Advanced Packaging Workshop

Date: September 24 - September 25 2019

Venue: Eastin Hotel, Penang & New World Hotel, Petaling Jaya

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20th International Conference on Electronic Packaging Technology (ICEPT)

Date: August 11 - August 15 2019

Venue: Hong Kong Science Park, Shatin

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EPS Events in 2017

An Overview of Membership Reward Program

Date: 2017

Venue: Malaysia

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2017 Semiconductor Advanced Packaging Workshop

Date: September 26 – September 27 2017

Venue: Eastin Hotel, Penang, Malaysia

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19th International Conference on Electronics Materials and Packaging (EMAP2017)

Date: September 25 – September 28 2017

Venue: Kunibiki Messe, Matsue, Shimane, Japan

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IEMT 2018 Conference Kick-Off Meeting

Date: August 28 2017

Venue: Penang, Malaysia

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18th International Conference on Electronic Packaging Technology (ICEPT)

Date: August 16 – August 19 2017

Venue: Harbin, China

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CREST 2017 Semiconductor & Optoelectronics Cluster Bootcamp Summary

Date: August 10 - August 12 2017

Venue: Universiti Sains Malaysia, Penang

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CPMT Best Engineering Student Award Update

Date: 2017

Venue: Malaysia

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IEEE Malaysia Section Leadership Meeting

Date: February 25 2017

Venue: Grand Blue Wave

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37th IEMT – 18th EMAP 2016: Closing Meeting

Date: February 2017

Venue: Malaysia

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Chapter AGM 2017

Date: January 14 2017

Venue: Bluewave Hotel, Shah Alam

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EPS Events in 2016

IEEE Malaysia Section Website Competition

Date: 2016

Venue: Malaysia

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IEEE R10 Chapter Chair Meeting at EPTC Singapore

Date: December 2 2016

Venue: EPTC Singapore

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IEEE CPMT Malaysia Best Final Year Project (FYP) Undergraduate Prizes 2016

Date: 2016

Venue: Malaysia

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IEEE-CPMT IMPACT Taiwan Conference

Date: October 26 - October 28 2016

Venue: Taipei Nangang Exhibition Center, Taiwan

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Summary of 37th IEMT & 18th EMAP 2016 Conference

Date: September 22 2016

Venue: Georgetown, Penang, Malaysia

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CPMT-CREST Collaboration Discussion

Date: April 7 2016

Venue: Penang, Malaysia

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Leadership Camp and Chapter Chair Meeting

Date: March 12 2016

Venue: Grand Bluewave Hotel, Shah Alam, Malaysia

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37th IEMT – 18th EMAP 2016: Packaging the Internet of Things

Date: 2016

Venue: G-Hotel, Penang, Malaysia

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Minutes of Chapter AGM 2016

Date: January 30 2016

Venue: Pullman Hotel, Bangsar, Malaysia

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EPS Events in 2015

Project Management Industry Evaluation At USM Chemical Engineering

Date: November 20 2015

Venue: Universiti Sains Malaysia, Penang

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Benchmarking Trip and Invited Speaker At IMPACT 2015 Taiwan

Date: October 21 - October 23 2015

Venue: Taipei Nangang Exhibition Center, Taipei, Taiwan

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IEEE CPMT Malaysia Awards Coverage

Date: September 8 2015

Venue: Curtin Sarawak, Miri

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Semiconductor Advanced Packaging Workshop 2015

Date: September 7 - September 8 2015

Venue: G Hotel, Penang & Shangri-La Hotel, Putrajaya

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10th IEEE 2015 Regional Symposium on Micro and Nano Electronics

Date: August 19 – August 21 2015

Venue: Primula Beach Hotel, Kuala Terengganu, Malaysia

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Engaging The Student Members: KBU Innovation Day

Date: June 11 2015

Venue: KBU

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Industry-Academia Forum

Date: March 25 2015

Venue: Malaysia

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Education Talk

Date: March 18 2015

Venue: Universiti Kebangsaan Malaysia

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IEEE Best FYP Project Awards 2015

Date: March - September 2015

Venue: Malaysia

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