2017 marks the third year that IEEE EPS Malaysia organizes the Best Engineering Student Award (BESA) for Malaysia undergraduate students. We increase the cash money to RM 3000 for a single student per university and a book gift entitled “Microelectronic Packaging in the 21st Century” (edited and sponsored by Rolf Aschenbrenner (Fraunhofer Inst.)) to be donated to the university library. BESA aims to encourage more students to be aware of a career in microelectronics components, packaging and manufacturing technology and to reward students who have excelled in carrying out outstanding undergraduate final year research project in board areas, such as, electrical/electronics, physics (incl. materials science), info-communication/ internet and related areas (hardware and software). Past recipient universities include Nottingham University Malaysia, University Malaysia Perlis, Inti International College, Curtin University Sarawak and KBU International College (now known as First City University College).