Date: 25th March 2015

Key Discussions from the Forum

Clusters Focus: Advance Materials & Packaging under Domain Areas of the followings

Semiconductor Device Packaging – Multi-chip Packaging (TUV, TSV

Cheaper Epoxy/Materials for mass market Optoelectronics

Compound semiconductor engineering (III-V)

Nano-materials and structures for interconnects, circuitry and thermal management

Materials for 3D printing, inkjet printing

The industry-academia forum is a platform initiated by CREST Malaysia to promote collaboration between industry partners and academia. The first forum was held on the 25th March with good participation from more than 25 academic researchers and industry experts in Malaysia in the area of advanced materials & packaging. The area of discussion included current technology trends and needs; research interests in the associated key technology areas and research expertise needs. The forum also intends to provide an opportunity to identify potential researchers from universities whom are interested to collaborate in these key research areas with industry partners. The CPMT Malaysia chapter was invited to collaborate and also facilitate the discussion session, focusing on the “Advanced Materials and Packaging” cluster. The participants were divided into 4 sub-teams and discussed on “Density, Power, Performance and Cost”, which are the key focus areas for advanced packaging which are heavily studied by the worldwide electronic community. Fruitful outputs were achieved from this initial discussion and the team also identified some potential steps to follow up, which included a revision on potential focus areas with suggestions from CPMT key members. Further engagement will be followed up with CREST team soon.