International Microsystems, Packaging, Assembly and Circuit Technology (IMPACT) is a joint international conference consisting of iMAPS All Asia Conference (IAAC) organized by IEEE EPS-Taipei, iMAPS-Taiwan, ITRI and TPCA. IEEE Malaysia EPS chapter was honoured to have its multiple submissions requested in both the Invited Papers and Oral Presentations categories. EPS Malaysia was represented by Shaw Fong Wong (from Intel Technology) who presented 2 invited papers entitled “Trends and Opportunity in Malaysia IoV” and “Packaging as IP Differentiator”. The other 5 oral presentations were presented by Malaysia delegates, from Altera-Intel, Jabil and Freescale-NXP. The overall successful IMPACT conference had become a vortex of valuable resource under various APAC region EPS chapters’ contribution and participation; a hallmark of strong collaboration forum between EPS Malaysia and Taipei on continuous technical sharing and professional development.