The “International Conference on Electronic Packaging Technology” (ICEPT)- one of IEEE EPS flagship conference, was organized outside mainland China for the first time, as to mark its notable milestone of 20th anniversary in 2019. The conference was held from 11th to 15th August 2019, at the Hong Kong Science Park, Shatin, featuring 6 professional development short courses, 3 opening address, 7 keynotes, near 300 interactive presentations, 8 exhibition booths and 1 complimentary technical site visit at ASM. Approximately 250 delegates, be industry professionals or academicians from region-wide participated in the conference that showcased the quality and quantity of late-breaking developments of emerging semiconductor packaging technologies for ICs, opto-electronics, passives, MEMS, etc. In addition, IEEE EPS R10 representatives also met up face-to-face to align on future collaborations. Kudos! to Hong Kong-China team, this feat would not have been possible without their tireless efforts.