E-Cert « EPS Malaysia

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Shortcourse

Advanced Packaging and Integration – Drivers, Technology Platforms, Challenges and Applications
Flip Chip Packaging – Key Processes Attributes, Challenges and Resolution
Reliability Mechanics Modeling and Simulation in Electronic Packaging – Thermo-Mechanics, Moisture, Dynamics and Electromigration
Fan-out Packaging and Chiplet Heterogeneous Integration
Power Electronics, Power Delivery, Thermal Management, and Heterogeneous Integration: Their Interplay that will define the Future of Semiconductor Systems
Analysis of Delamination in Microelectronics Packages
Advanced Packaging Challenges and Investigation Strategies

E-Certificate