The IEEE Electronics Packaging Society is the leading international forum for scientists and engineers engaged in the research, design and development of revolutionary advances in microsystems packaging and manufacturing.
Its objectives are scientific, literary, and educational in character. The Society strives for the advancement of the theory and practice of electrical and electronics engineering and of the allied arts and sciences, and the maintenance of a high professional standing among…
Date: 16th December 2020 (Wednesday)
Time: 9.00-10.00 a.m (M’sia Time, GMT +8:00)
Platform: CISCO Webex
By DR HongWen Zhang & Manager,
Alloy Group Indium Corporation’s R&D Depertment
IEEE has a “No Returns” policy. However, IEEE will gladly replace damaged or missing publications. For information, including returns policies, related to IEEE Standards, Conference Publications, and IEEE Books and eBooks, click….
At IEEE, we respect your privacy. We want to ensure that you get the information, content, and experiences that matter most to you.IEEE is committed to protecting…
Date: 14 October 2020 (Wednesday)
Time: 09.30 AM – 11.00 AM (GMT +8)
Platform: CISCO Webex
By DR ANDY MACKIE Principle Engineer & Manager,
Thermal Interface Material Applications Indium Corporation
Date: 16 October 2020 (Friday)
Time: 09.30 AM – 11.00 AM (GMT +8)
Platform: CISCO Webex
By DR RAVI MHAJAN
Fellow & Director Technology & Manufacturing Group Intel Corporation
IEEE has a “No Returns” policy. However, IEEE will gladly replace damaged or missing publications. For information, including returns policies, related to IEEE Standards, Conference Publications, and IEEE Books and eBooks, click….
At IEEE, we respect your privacy. We want to ensure that you get the information, content, and experiences that matter most to you.IEEE is committed to protecting…
