The 2019 Semiconductor Advanced Packaging Workshop organized by IEEE EPS Malaysia Chapter is back! The bi-annual one-day technical workshop took place at Eastin Hotel, Penang and New World Hotel, Petaling Jaya scheduled on September 24th and 25th respectively. It featured contemporary packaging trends and development of emerging technologies from two distinguished speakers in the field of semiconductor: (1) Prof. Dr. Madhavan Swaminathan (Georgia Tech, USA) on “Intelligent Digital Convergence for AI and 5G” (2) Dr. John Lau Hon Shing (UMTC, Taiwan) on “Fan-Out Wafer/Panel-Level Packaging & Heterogeneous Integrations (SiPs)”.

Approximately 180 attendees – a diverse group of industry professionals, researchers and undergraduates from 30+ companies and local universities Malaysia wide participated in this informative and quality knowledge sharing session. In 2019, EPS Malaysia Chapter and Anton-Paar Sdn. Bhd. have exceptionally extended sponsorship to academia, primarily aimed at providing industrial exposure to potential graduates. What’s next from IEEE EPS Malaysia Chapter to constantly motivating regional engineering community on technical excellence? –it’s the 39th International Electronics Manufacturing Technology (IEMT) 2020 Conference. We are looking forward to seeing you next year in Putrajaya!!