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Lim Wee Teck, Secretary

[email protected]

Lim Wee Teck, Secretary

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Past Events by EPS Malaysia

ALL EVENTS ORGANIZED BY EPS MALAYSIA

The following activities have been tentatively planned for the year 2015 and upcoming 2016. These activities have been carefully considered and the speakers/invited guests are well selected to bring the utmost benefit and knowledge advancement to IEEE-EPS Malaysian Chapter members.

2016 KEY EVENTS

37th International Electronics Manufacturing Technology (IEMT) - 18th Electronics Materials & Packaging (EMAP) Conference 2016

by Electronics Packaging Society (EPS) of IEEE & Korean-American Scientists and Engineers Association

Date: 20th-22nd SEPTEMBER, 2016
Venue: G HOTEL, GEORGE TOWN, PENANG, MALAYSIA

EPS Events in 2015
  • Technical Events

    SEMICONDUCTOR ADVANCED PACKAGING WORKSHOP: LATEST TRENDS IN ADVANCED PACKAGING: DRIVING PACKAGE VOLUMES WITH MOBILE AND WEARABLE PRODUCTS

    by E. Jan Vardaman (President TechSearch International, Inc. Austin, Texas) 

    Date & Venue: G HOTEL, PENANG, 7th SEPTEMBER, 2015
    Date & Venue: SHANGRI-LA HOTEL, PUTRAJAYA, 8th SEPTEMBER, 2015

    SEMICONDUCTOR ADVANCED PACKAGING WORKSHOP: INTERNET OF EVERYTHING – LATEST TREND, CHALLENGES, APPLICATIONS AND CASE STUDIES

    by Hamid Syed (Director, Supply Chain Cisco (HK) Ltd Hong Kong)

    Date & Venue: G HOTEL, PENANG, 7th SEPTEMBER, 2015
    Date & Venue: SHANGRI-LA HOTEL, PUTRAJAYA, 8th SEPTEMBER, 2015

    Technical Seminar "Finite Element Modelling in Electronic Packaging"

    by Prof. Dr Mohd Nasir Tamin (Universiti Teknologi Malaysia) 

    Date:TBD, 2015

    Technical Seminar "Metallic Nanoparticle Loaded Lead-Free Solder: Interfacial Structure & Properties"

    by Prof. Dr Haseeb (Universiti Malaya)

    Date:TBD, 2015

    Semiconductor Advanced Packaging Workshop

    by Ms. Rozali Beica (France) , Dr. Leo Lorenz (Germany)

    Date & Venue: 23rd SEPTEMBER 2013, PENANG

    Date & Venue: 24th SEPTEMBER 2013, PUTRAJAYA

    Semiconductor Advanced Packaging Workshop

    by E.Jan Vardamen (USA) , Hamid Syed (Hong Kong)

    Date & Venue : 7th SEPTEMBER 2015, PENANG

    Date & Venue: 8th SEPTEMBER 2015, PUTRAJAYA

  • Education Events

    Education Talk "“I Have Never Registered Even Though I Have Worked as an Engineer for Years – Is It Really Necessary?”

    by Adj. Prof Cheang Kok Meng (former Executive Director, Institution of Engineers Malaysia)

    Date: 18th MARCH 2015

    IEEE Best FYP Projects Award 2015

    Recognition for Best IEEE Final Year Project

    Date: MARCH until DECEMBER, 2015

  • Professional Courses

    1 day course on "Advanced Packaging for Microelectronic Packaging"

    One course each in Klang Valley & Penang

    Date: SEPTEMBER 2015

Past IEMT Conferences

35th International Electronics Manufacturing Technology (IEMT) Conference 2012

Date: November 6 – November 8 2012
Venue: Kinta Riverfront Hotel, Ipoh, Perak, Malaysia

37th International Electronics Manufacturing Technology (IEMT) – 18th Electronics Materials & Packaging (EMAP) Conference 2016

Date: September 20 – September 22 2016
Venue: G Hotel, Penang, Malaysia

36th International Electronics Manufacturing Technology (IEMT) Conference 2014

Date: November 11 – November 13 2014
Venue: Renaissance Hotel, Johor Bahru, Johor, Malaysia

35th International Electronics Manufacturing Technology (IEMT) Conference 2012

Date: November 6 – November 8 2012
Venue: Kinta Riverfront Hotel, Ipoh, Perak, Malaysia

36th International Electronics Manufacturing Technology (IEMT) Conference 2014

Date: November 11 – November 13 2014
Venue: Renaissance Hotel, Johor Bahru, Johor, Malaysia

37th International Electronics Manufacturing Technology (IEMT) – 18th Electronics Materials & Packaging (EMAP) Conference 2016

Date: September 20 – September 22 2016
Venue: G Hotel, Penang, Malaysia

EPS Conferences in 2015

2015 65th IEEE Electronic Components & Technology Conference (ECTC 2015)

Date: May 26 – May 29 2015
Venue: San Diego, CA USA

6th Asia Symposium on Quality Electronic Design (ASQED 2015): Internet of Things (IoT)

Date: August 3 – August 5 2015
Venue: Penang, Malaysia

2015 16th International Conference on Electronic
Packaging Technology (ICEPT)

Date: August 11 – August 14 2015
Venue: Changsha, China

2015 20th European Microelectronics Packaging
Conference (EMPC)

Date: September 14 – September 16 2015
Venue: Friedrichshafen, Germany

2015 Workshop on Accelerated Stress Testing & Reliability (ASTR)

Date: September 9 – September 11 2015
Venue: Boston, MA USA

2015 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Date: October 26 – October 29 2015
Venue: Portland, OR USA

2015 IEEE 24th Electrical Performance of Electronic
Packaging & Systems (EPEPS)

Date: October 25 – October 28 2015
Venue: San Jose, CA USA

2015 65th IEEE Electronic Components & Technology Conference (ECTC 2015)

Date: May 26 – May 29 2015
Venue: San Diego, CA USA

6th Asia Symposium on Quality Electronic Design
(ASQED 2015): Internet of Things (IoT)

Date: August 3 – August 5 2015
Venue: Penang, Malaysia

2015 16th International Conference on Electronic
Packaging Technology (ICEPT)

Date: August 11 – August 14 2015
Venue: Changsha, China

2015 20th European Microelectronics Packaging
Conference (EMPC)

Date: September 14 – September 16 2015
Venue: Friedrichshafen, Germany

2015 Workshop on Accelerated Stress Testing & Reliability (ASTR)

Date: September 9 – September 11 2015
Venue: Boston, MA USA

2015 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Date: October 26 – October 29 2015
Venue: Portland, OR USA

2015 IEEE 24th Electrical Performance of Electronic
Packaging & Systems (EPEPS)

Date: October 25 – October 28 2015
Venue: San Jose, CA USA